Bond investors are becoming more selective about financing AI-related projects, especially as 10-year U.S. Treasury yields have risen above 5.25% in early October. That relatively attractive risk-free rate combined with the ample supply of debt to fund the AI build-out means that investors can demand higher yields and more favorable terms when it comes to AI debt deals.
It’s important to differentiate between higher quality investment-grade bonds (BBB/Baa and above) issued by large technology companies and debt issued by more speculative borrowers. Despite strong balance sheets, substantial cash flows, and proven businesses, some of the debt issued by these borrowers is trading at wider spreads than many industrial companies. This is partly because of the amount of debt issued in a short period of time and the expectation of more AI-related debt issuance to come.
As a high-yield investor, I’m paying attention to this debt surge and where it is trading, while being selective when it comes to investing in below investment grade debt (BB/Ba and below) issued to fund the AI build-out. With a lot of options available to me across the ratings spectrum and keeping in mind that more issuance is likely to come, I am being very patient when it comes to allocating to the sector.
If the cost of capital to fund new AI-related infrastructure continues to climb, the biggest winners may be facilities already well on their way to completion and those already up and running. Demand for AI computing capacity is still strong, so existing facilities could charge more for their services. Similarly, I could see issuance slow given the backup in demand for debt, which could require companies to fund more of the build-out using equity. This could make future new issuance more attractive than what’s already in the market given the potential for lower leverage.